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71321LA55TFG is listed in the Memory IC range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC SRAM 16KBIT PARALLEL 64TQFP. Review the specifications below when checking this part for your BOM.
The 71321LA55TFG is a dual-port static random-access memory (SRAM) integrated circuit manufactured by Renesas Electronics Corporation. It features a storage capacity of 16 kilobits organized as 2K words by 8 bits. The device utilizes an asynchronous parallel interface with a maximum access time of 55 nanoseconds. It operates within a supply voltage range of 4.5V to 5.5V and supports surface-mount installation in a 64-pin Thin Quad Flat Package (TQFP). The component is designed for industrial temperature ranges, typically spanning from -40°C to +85°C.
Verify the exact suffix configuration against official Renesas documentation, as variations such as TFGI or TFI may indicate different packaging or compliance statuses. Confirm current production status, as many variants in this series are obsolete. Ensure compatibility with existing board layouts regarding pin assignments and thermal requirements before procurement.
Select this component when dual-port functionality is required for concurrent master access. Compare access times against system timing constraints; the 55ns variant suits moderate-speed applications. Verify package dimensions match the PCB footprint. Consider RoHS compliance if environmental regulations apply, noting that older suffixes may differ.
This part belongs to the Renesas 71321SA/LA series of dual-port SRAMs. These devices are widely used in telecommunications and industrial automation where independent port access is critical. The LA suffix typically denotes extended temperature ranges compared to the SA series. The family offers various speed grades and package options to fit diverse design needs.
Official upgrades include the 71321LA25TFG8 for faster performance. Verify pin compatibility and electrical specifications before substitution. Obsolete parts may require redesigning the PCB layout if package dimensions differ significantly from the replacement.
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