7132LA100CB

Memory IC Overview

The Renesas Electronics Corporation 7132LA100CB is a static random access memory (SRAM) device with a storage capacity of 16 kbit, organized as 2k x 8. It features an asynchronous dual-port architecture with parallel interface. The component supports a supply voltage range of 4.5 V to 5.5 V and has a maximum access time of 100 ns. It is housed in a 48-lead CDIP-SB package designed for through-hole mounting.

Memory IC Feature Summary

• Dual-port architecture enabling simultaneous independent access by two processors
• Asynchronous operation without clock synchronization requirements
• CMOS technology construction for standard logic compatibility

Memory IC Applications

• High-speed data buffering in communication systems
• Cache memory implementation in embedded controllers
• Data storage in industrial automation equipment

Memory IC Procurement Notes

This component is officially scheduled for obsolescence and will be discontinued by the manufacturer. Verify current availability status with authorized distributors before finalizing procurement plans. Ensure compliance with RoHS regulations as specified in the official datasheet. Confirm package integrity upon receipt due to end-of-life handling protocols.

Memory IC Selection Notes

Select this part when a 16 kbit dual-port SRAM with 100 ns access speed is required. The 48-lead ceramic DIP package suits through-hole PCB designs. Verify that the 4.5 V to 5.5 V operating voltage aligns with system power rails. Consider the asynchronous nature for simple interface timing requirements.

Memory IC Part Context

The 7132LA100CB belongs to the Renesas 7132 series of dual-port SRAMs. It shares architectural similarities with other members like the 7132LA55CB but offers slower access times. The device utilizes CMOS technology and is functionally equivalent to legacy IDT parts such as the IDT7132LA100CB.

Memory IC Replacement Considerations

The Renesas 7132SA35C is identified as a functional substitute based on matching memory capacity, organization, technology, interface type, and package form.