71P72604S167BQG

Memory IC Overview

The IDT71P72604S167BQG is a high-speed synchronous SRAM manufactured by Integrated Device Technology. It features a memory density of 18 Mbit, organized as 1M x 18 bits. The device supports a maximum clock frequency of 167 MHz and offers a typical access time of 3.5 ns. It operates with a 3.3V core voltage and utilizes a 165-ball Chip Array BGA package measuring 13mm by 15mm.

Memory IC Feature Summary

• Supports high system speeds up to 167 MHz for demanding applications
• Provides fast data access with a 3.5 ns typical clock-to-data access time
• Utilizes a flow-through architecture for continuous data throughput

Memory IC Applications

• High-performance networking equipment requiring low-latency buffering
• Telecommunications systems utilizing synchronous memory interfaces
• Industrial control systems needing rapid data processing capabilities

Memory IC Procurement Notes

Verify the specific suffix 'BQG' against official Renesas or IDT documentation to confirm the exact package type and temperature range. Ensure compatibility with 3.3V logic levels and check for RoHS compliance status in current datasheets before procurement.

Memory IC Selection Notes

Select this component when a 18 Mbit capacity and 167 MHz operation are required. Compare pinout and electrical characteristics with similar models like the IDT71P72604S167BQI if interface variations are needed. Confirm package dimensions fit the PCB layout constraints.

Memory IC Part Context

This part belongs to the IDT 71P series of synchronous SRAMs designed for high-speed parallel data transfer. These devices are engineered to replace asynchronous memories in modern high-frequency digital systems, offering improved bandwidth and reduced bus turnaround times compared to legacy components.

Memory IC Replacement Considerations

Check for direct substitutes such as the IDT71P72604S167BQI or IDT71P72604S167BQG8. Verify that alternative packages maintain identical pin configurations and electrical specifications to ensure seamless integration without hardware redesign.