71T75602S166BGI8

Memory IC Overview

The Renesas Electronics Corporation 71T75602S166BGI8 is a synchronous static random-access memory (SRAM) integrated circuit featuring an 18 Mbit storage capacity organized as 512K x 36. It operates with a maximum clock frequency of 166 MHz and a typical access time of 3.5 ns. The device utilizes a parallel interface and functions within a supply voltage range of 2.375 V to 2.625 V, with a maximum power consumption of 265 mA. It is housed in a 119-PBGA package measuring 14x22 mm and supports an extended industrial operating temperature range from -40°C to +85°C.

Memory IC Feature Summary

• Supports high-speed data transfer via a 166 MHz synchronous parallel interface
• Provides wide data bus width through a 36-bit organization structure
• Operates reliably across an extended industrial temperature range

Memory IC Applications

• High-performance networking equipment requiring fast buffer memory
• Telecommunications systems utilizing wide data buses
• Industrial control systems operating in harsh thermal environments

Memory IC Procurement Notes

Verify component authenticity due to discontinuation status. Confirm RoHS compliance requirements as the part may not meet current standards. Check for moisture sensitivity level handling during assembly. Ensure replacement availability aligns with long-term production needs. Validate package dimensions against existing PCB footprints.

Memory IC Selection Notes

Select this component for applications demanding wide 36-bit data paths and low latency. Consider the PBGA package constraints for board layout. Evaluate thermal management capabilities given the power consumption specifications. Assess compatibility with existing system clock frequencies up to 166 MHz. Verify voltage regulator stability within the specified 2.375 V to 2.625 V range.

Memory IC Part Context

This SRAM belongs to the 71T75602 series, designed for high-throughput memory applications. It represents a specific variant within the ZBT family, optimized for speed and data width. The manufacturer has indicated end-of-life status for this product line, affecting long-term sourcing strategies.

Memory IC Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation.