71V016SA20BFG

Memory IC Overview

The Renesas Electronics Corporation 71V016SA20BFG is a static random-access memory (SRAM) device with a total storage capacity of 1 Mbit. The memory organization is specified as 64K words by 16 bits, utilizing a parallel interface for data transfer. It operates within a supply voltage range of 3 V to 3.6 V and features an asynchronous access time of 20 ns. The component supports a maximum power supply current of 120 mA and is designed for surface-mount installation in a 48-pin CABGA package. The operational temperature range extends from -40°C to +85°C.

Memory IC Feature Summary

• Provides non-volatile-like fast read/write capabilities via asynchronous parallel interface
• Supports standard 3.3 V logic levels for system integration
• Designed for industrial temperature environments

Memory IC Applications

• Industrial control systems requiring fast local data buffering
• Embedded processing applications needing rapid temporary data storage
• Communication equipment cache memory implementations

Memory IC Procurement Notes

Verify the exact suffix against official Renesas documentation, as 'BFG' may denote specific packaging or qualification variants not fully detailed in general listings. Confirm end-of-life status and availability through authorized distributors, as this series has faced discontinuation notices. Ensure compatibility with existing PCB footprints and thermal management requirements before procurement.

Memory IC Selection Notes

Select this component when a 64K x 16 configuration is required with 20 ns access speed. Compare against other 71V016SA variants if faster access times like 10 ns are needed, noting potential differences in power consumption and package types. Verify that the 48-pin CABGA footprint matches the design constraints and that the operating temperature range meets the application's environmental specifications.

Memory IC Part Context

This part belongs to the IDT/Renesas 71V016SA family of high-performance asynchronous SRAMs. These devices are engineered for applications demanding low latency and high reliability. The family typically offers various access speeds and package options to suit different board space and performance requirements in embedded and industrial markets.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers for this specific variant are not available in the provided source material.