71V3559S75PFG8

Memory IC Overview

The 71V3559S75PFG8 is a synchronous single data rate static random access memory integrated circuit manufactured by Renesas Electronics Corporation. It features a storage capacity of 4.5 megabits organized as 256K words by 18 bits. The device supports parallel interface operations with an access time of 7.5 nanoseconds and a maximum clock frequency of 87 MHz. It operates within a supply voltage range of 3.135 to 3.465 volts and functions at temperatures between 0°C and 70°C. The component is housed in a 119-pin plastic ball grid array package measuring 14 by 22 millimeters.

Memory IC Feature Summary

• Supports synchronous burst mode operation for high-speed data transfer
• Includes self-timed write cycles with global write control capabilities
• Features power-down functionality controlled by dedicated input pins

Memory IC Applications

• High-performance computing systems requiring fast memory access
• Telecommunications equipment utilizing parallel SRAM interfaces
• Industrial automation controllers needing reliable volatile storage

Memory IC Procurement Notes

Verify the specific suffix BG8 confirms the 119-PBGA package configuration. Confirm RoHS compliance status as documentation indicates potential non-compliance. Check current production status as this part number may be obsolete or subject to end-of-life notices. Ensure temperature grade matches industrial requirements if operating outside standard ranges.

Memory IC Selection Notes

Select this component when a 256K x 18 organization is required for parallel data paths. Consider the 7.5 ns access time for timing constraints in synchronous designs. Evaluate the 119-ball BGA footprint against available board space and routing complexity. Compare against other 71V3559 variants if different package types or speed grades are needed.

Memory IC Part Context

This device belongs to the 71V3559 family of synchronous SRAMs designed for high-density applications. The family typically offers various speed grades and packaging options to suit different system architectures. These components are engineered to provide low latency and high throughput for complex digital signal processing tasks.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with existing PCB layouts and electrical specifications before considering alternative sources.