74FCT162373ATPVG8

Latches Overview

The Renesas Electronics Corporation 74FCT162373ATPVG8 is a 16-bit transparent D-type latch constructed using advanced dual metal CMOS technology. It operates within a voltage range of 4.5V to 5.5V and supports surface-mount installation in a 48-TSSOP package. The device provides high-speed data storage capabilities with low power consumption, suitable for mixed 3.3V/5V supply systems.

Latches Feature Summary

• High-speed operation utilizing advanced dual metal CMOS technology
• Low power consumption characteristics typical of CMOS logic families
• Capable of functioning as two independent 8-bit latches or one unified 16-bit latch

Latches Applications

• Temporary data storage in digital circuits
• Memory address latching applications
• I/O port buffering and control
• Bus driver implementations

Latches Procurement Notes

Verify component authenticity through authorized channels due to end-of-life status. Confirm package markings and datasheet revisions match the specific manufacturing lot. Ensure compatibility with existing PCB footprints and thermal management requirements before integration into new designs.

Latches Selection Notes

Select this component for designs requiring 16-bit parallel data retention with transparent latch functionality. Consider the 48-TSSOP package constraints and operating temperature range. Evaluate system timing requirements against the device's propagation delay specifications to ensure signal integrity.

Latches Part Context

This part belongs to the 74FCT series of Fast CMOS logic devices. It serves as a specialized memory element within the broader family of high-speed, low-power logic integrated circuits designed for complex digital systems requiring reliable data handling and interface translation.

Latches Replacement Considerations

The manufacturer has declared this product obsolete. Designers should evaluate alternative components from the same logic family or compatible pin-to-pin replacements that meet the required electrical specifications and package dimensions.