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74HC4060BQ-Q100,11 is listed in the Counter Dividers range at ChipApex. The manufacturer field lists Nexperia USA Inc.. Its product description is IC BINARY COUNTER 14BIT 16DHVQFN. Review the specifications below when checking this part for your BOM.
The Nexperia 74HC4060BQ-Q100,11 is a 14-stage binary ripple counter and oscillator housed in a DHVQFN16 package (SOT763-1). It features ten buffered parallel outputs (Q3 to Q9, Q11 to Q13) and an overriding asynchronous master reset. The device supports RC or crystal oscillator configurations via RTC and CTC terminals, or accepts an external clock at RS. It operates within a supply voltage range of 2.0 V to 6.0 V and complies with AEC-Q100 Grade 1 standards for automotive applications.
Verify the specific suffix '11' corresponds to the standard tape-and-reel packaging configuration as defined by Nexperia. Confirm that the DHVQFN16 thermal pad soldering follows the floating or VCC-connected guidelines to prevent electrical shorts. Ensure the design accounts for the specified ambient temperature operating range up to +125 °C when calculating power dissipation limits.
Select this component for designs requiring a dedicated internal oscillator or precise frequency division in automotive environments. The HC logic family provides CMOS low power dissipation suitable for battery-operated systems. Verify input voltage compatibility against the CMOS level requirements, distinguishing it from the HCT variant which utilizes TTL levels.
This part belongs to the Nexperia 74HC4060-Q100 series, which includes variants such as the SO16 and TSSOP16 packages. The BQ designation specifically identifies the DHVQFN16 leadless package format. All members of this series share identical functional characteristics and electrical parameters, differing only in physical footprint and pin arrangement.
Direct substitutes include the 74HC4060D-Q100 and 74HC4060PW-Q100. These alternatives offer identical logical functions but utilize SO16 and TSSOP16 packages respectively. Designers must verify board space constraints and thermal management capabilities before substituting the DHVQFN16 package with these leaded options.
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