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7WBD3306MUTAG is listed in the Signal Switches, Multiplexers, Decoders range at ChipApex. The manufacturer field lists onsemi. Its product description is IC BUS SWITCH 1 X 1:1 8UDFN. Review the specifications below when checking this part for your BOM.
The 7WBD3306MUTAG is a translating bus switch manufactured by onsemi, designed for voltage level translation between different logic domains. It features an 8-lead US package and operates within a supply voltage range of 4 V to 5.5 V. The device supports a maximum propagation delay of 250 ps and functions reliably across an extended temperature range from -55 °C to +125 °C. With a power dissipation rating of 498 mW, it is suitable for surface-mount applications requiring efficient signal routing and level shifting in digital systems.
Verify the exact part number suffix against official documentation, as variations may indicate differences in packaging or tape-and-reel specifications. Confirm RoHS compliance status through current manufacturer declarations. Check for obsolescence notices or product change notifications prior to procurement to ensure long-term availability and consistency with design requirements.
Select this component when bidirectional voltage translation is required between 3.3 V and 5 V logic interfaces. Ensure the operating environment stays within the specified -55 °C to +125 °C temperature range. Verify that the system supply voltage remains within the 4 V to 5.5 V limits to maintain proper switching characteristics and avoid damage to the internal circuitry.
This component belongs to the 7WBD3306 series of translating bus switches from onsemi. It is engineered for applications requiring seamless integration between different voltage levels without external components. The US-8 package provides a compact footprint suitable for space-constrained designs while maintaining robust electrical performance for data transmission tasks.
The 7WBD3306DTR2G is a documented substitute offering similar functionality in a TSSOP-8 package. Verify pin compatibility and package dimensions before substitution to ensure mechanical fit and electrical equivalence in the target application.
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