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801-83-034-20-002101 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Preci-Dip. Its product description is CONN SOCKET 34P 0.1 GOLD PCB R/A. Review the specifications below when checking this part for your BOM.
The Preci-Dip 801-83-034-20-002101 is a socket connector from the 801 series, designed for board-to-board applications. It features 34 positions with a 0.100-inch (2.54mm) pitch and utilizes surface mount right-angle termination. The contacts are made of beryllium copper with gold plating on the mating interface and tin plating on the post. Rated for 3A at 150VDC, it operates within a temperature range of -55°C to 125°C. The housing is black PCT polyester reinforced with glass fiber, meeting UL94 V-0 flammability standards.
Verify the specific ordering suffix to confirm contact finish and mounting style. Ensure compatibility with the mating header series. Check RoHS compliance status for environmental regulations. Confirm moisture sensitivity level for storage and handling requirements. Validate that the supplier provides official datasheets for technical reference.
Select this component when surface mount technology is required for high-density connections. The right-angle orientation aids in compact board stacking. Gold plating is suitable for low-signal applications requiring corrosion resistance. Verify current ratings against circuit demands. Consider the push-pull feature for secure mechanical retention during vibration.
This part belongs to the Preci-Dip 801 series of single inline sockets. The series offers various pin counts and mounting options including through-hole and surface mount variants. The 801-83 designation indicates a specific configuration within this family, focusing on reliability and standard spacing for general-purpose interconnects.
Compatible substitutes include other 801 series sockets with matching pin counts and surface mount profiles. Verify identical pitch and contact material specifications. Ensure equivalent electrical ratings and thermal performance. Cross-reference mechanical dimensions for board space constraints.
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