803-83-084-53-001101

Headers, Receptacles, Female Sockets Overview

The Preci-Dip 803-83-084-53-001101 is a board-to-board socket connector from the 803 series. It features 84 positions arranged in two rows with a 2.54 mm pitch. The connector utilizes through-hole termination and push-pull locking for secure attachment. Contacts are made of beryllium copper with gold plating, rated for 3A current at 150VDC. The housing is black glass-filled polyester, operating between -55°C and 125°C.

Headers, Receptacles, Female Sockets Feature Summary

• Push-pull locking mechanism ensures secure mating and unmating.
• Gold-plated beryllium copper contacts provide reliable conductivity.
• Glass-filled polyester insulation offers structural stability.

Headers, Receptacles, Female Sockets Applications

• Board-to-board interconnections
• Mezzanine circuit connections

Headers, Receptacles, Female Sockets Procurement Notes

Verify the specific ordering suffix to confirm pin count, row configuration, and contact plating thickness. Ensure the selected variant matches the required mechanical locking style and termination method for the target PCB assembly design.

Headers, Receptacles, Female Sockets Selection Notes

Select this component when high-density board-to-board connectivity is required. The push-pull system aids in alignment during mating. Verify that the 2.54 mm pitch aligns with the mating header dimensions and that the 3A rating meets the circuit load requirements.

Headers, Receptacles, Female Sockets Part Context

This part belongs to the Preci-Dip 803 series of rectangular connectors. The series provides various configurations for board-to-board applications, utilizing standardized spacing and robust materials for consistent performance across different electronic assemblies.

Headers, Receptacles, Female Sockets Replacement Considerations

Compatible mating headers include models such as 803-87-084-20-001101. Verify that substitute parts maintain identical pitch, row count, and locking mechanism specifications before integration.