803-87-004-10-005101

Headers, Receptacles, Female Sockets Overview

The Preci-Dip 803-87-004-10-005101 is a board-to-board connector socket from the 803 series. It features 4 positions with a 2.54 mm pitch and operates at 150V. The unit utilizes gold-plated beryllium copper contacts housed in black glass-filled polyester insulation. Designed for surface mount installation, it offers right-angle termination for PCB integration.

Headers, Receptacles, Female Sockets Feature Summary

• Gold-plated beryllium copper contacts ensure reliable signal transmission
• Glass-filled polyester housing provides structural stability
• Right-angle surface mount design facilitates compact PCB layouts

Headers, Receptacles, Female Sockets Applications

• Board-to-board interconnections
• Surface mount PCB assemblies
• Electronic device internal wiring

Headers, Receptacles, Female Sockets Procurement Notes

Verify the specific ordering suffix to confirm the exact contact count and orientation. Ensure compatibility with the mating header specifications regarding pitch and current ratings. Confirm surface mount requirements align with the manufacturing process capabilities before finalizing procurement orders.

Headers, Receptacles, Female Sockets Selection Notes

Select this component when a low-profile, right-angle surface mount solution is required for minimal position counts. The 2.54 mm pitch ensures broad compatibility with standard headers. Consider the thermal limits of the polyester material during soldering processes to maintain connection integrity.

Headers, Receptacles, Female Sockets Part Context

This part belongs to the Preci-Dip 803 series, which specializes in high-density board-to-board connections. The series supports various pin counts and mounting styles, providing standardized interfaces for modern electronic systems requiring reliable vertical or angled interconnects.

Headers, Receptacles, Female Sockets Replacement Considerations

Compatible substitutes include other 803 series variants with matching pin counts and orientations. Verify that alternative sources offer identical gold plating thickness and berybelium copper alloy composition to maintain electrical performance standards.