895-049-544-402

Edgeboard Connectors Overview

The EDAC Inc. 895-049-544-402 is a standard card edge connector receptacle designed for vertical panel mount applications. It features a single row with 49 positions and a 2.54 mm (0.100 inch) pitch. The contacts are made of copper alloy with gold plating, rated for 3 A current. The housing utilizes polyphenylene sulfide (PPS) material, providing an insulation resistance of 5 GOhms. It supports wire wrap termination and operates within a temperature range of -40°C to +125°C.

Edgeboard Connectors Feature Summary

• Vertical panel mount configuration for secure installation
• Gold-plated copper alloy contacts ensure reliable signal transmission
• Polyphenylene sulfide housing offers high thermal stability

Edgeboard Connectors Applications

• Industrial control systems requiring robust interconnects
• Telecommunications equipment board connections
• Automotive electronics modules

Edgeboard Connectors Procurement Notes

Verify the specific ordering suffix against official EDAC documentation to confirm contact type and termination method. Ensure compatibility with target PCB thickness specifications before integration. Confirm RoHS compliance status through current manufacturer declarations.

Edgeboard Connectors Selection Notes

Select this component when a single-row, 49-position interface is required for vertical mounting. The 2.54 mm pitch aligns with standard card edge designs. Consider the wire wrap termination requirement during PCB layout planning.

Edgeboard Connectors Part Context

This part belongs to the EDAC 895 series of standard card edge connectors. The series provides various position counts and termination options for diverse electronic assembly needs. The 895 series is characterized by its durable construction and consistent electrical performance across different industrial environments.

Edgeboard Connectors Replacement Considerations

Consult official EDAC substitution guides for verified alternatives. Cross-reference pin counts and mechanical dimensions to ensure functional equivalence without redesigning the host assembly.