A-SL200-EG-Z30MP1

Headers, Male Pins Overview

The A-SL200-EG-Z30MP1 is a surface mount connector header from the A-SL200 series, manufactured by Assmann WSW Components. It features a 30-position configuration with a 2.00mm (0.079 inch) pin spacing. The component utilizes gold-plated contacts and is designed for board-to-board applications. Key electrical ratings include a current capacity of 1A and a voltage rating of 125V. The operating temperature range spans from -40°C to 105°C.

Headers, Male Pins Feature Summary

• Surface mount technology implementation for automated PCB assembly
• Gold-plated contact surfaces ensuring reliable signal transmission
• High-density 30-pin layout within a compact footprint

Headers, Male Pins Applications

• Board-to-board interconnections in electronic assemblies
• Industrial control system circuit boards
• Consumer electronics internal connectivity

Headers, Male Pins Procurement Notes

Verify the specific suffix 'Z' and 'MP1' against official datasheets to confirm surface mount orientation and packaging type. Ensure compatibility with the mating socket's mechanical dimensions and contact plating requirements before integration into production designs.

Headers, Male Pins Selection Notes

Select this component when a low-profile surface mount header is required for high-density connections. The 2.00mm pitch offers a balance between pin count and spacing. Confirm that the PCB land pattern matches the specified surface mount terminal geometry for proper soldering.

Headers, Male Pins Part Context

This part belongs to the A-SL200 series, which provides various configurations of headers and sockets. The series supports both through-hole and surface mount technologies, catering to diverse manufacturing needs for standard and custom connector solutions.

Headers, Male Pins Replacement Considerations

Cross-reference with other Assmann WSW surface mount headers in the A-SL200 series. Verify that substitute parts maintain identical 2.00mm pitch, 30-pin count, and gold plating specifications to ensure functional interchangeability.