A-SL200EA23-036-GST1

Headers, Male Pins Overview

The A-SL200EA23-036-GST1 is a surface mount pin header from the A-SL200 series by Assmann WSW Components. It features 23 positions with a 2.00mm (0.079 inch) pitch. The connector utilizes gold-plated contacts and is designed for right-angle board-to-board applications.

Headers, Male Pins Feature Summary

• Surface mount construction for automated assembly
• Right-angle orientation for compact layouts
• Gold contact plating for reliable signal transmission

Headers, Male Pins Applications

• Board-to-board interconnections
• Compact electronic device assemblies
• Automated surface mount manufacturing lines

Headers, Male Pins Procurement Notes

Verify the specific suffix codes against official manufacturer documentation to confirm exact pin count, plating thickness, and reel packaging specifications. Ensure compatibility with standard SMT reflow profiles and verify that the right-angle footprint matches the target PCB design requirements before finalizing procurement orders.

Headers, Male Pins Selection Notes

Select this component when a low-profile, right-angle connection is required for space-constrained designs. The surface mount format supports high-volume production efficiency. Confirm that the 2.00mm pitch aligns with mating connector standards and that the 23-position length fits within the available board area without obstructing adjacent components.

Headers, Male Pins Part Context

This part belongs to the A-SL200 series, which focuses on IDC and flat cable connectors as well as standard pin headers. Assmann WSW Components specializes in developing tailored connector solutions for various industrial and consumer electronics applications, providing both standard and custom configurations.

Headers, Male Pins Replacement Considerations

Cross-reference with other 23-position, 2.00mm pitch surface mount right-angle headers from compatible manufacturers. Verify mechanical dimensions, solder pad patterns, and mating interface compatibility to ensure functional equivalence without redesigning the host PCB layout.