A-SL254-EA-Z22MP1

Headers, Male Pins Overview

The A-SL254-EA-Z22MP1 is a male pin header connector manufactured by Assmann WSW Components. It features a single row of 22 positions with a 2.54 mm (0.100 inch) pitch. The component utilizes surface mount technology for board attachment and incorporates a right-angle design to facilitate perpendicular cable routing relative to the PCB plane.

Headers, Male Pins Feature Summary

• Right-angle surface mount configuration
• Single row contact arrangement
• Standard 2.54 mm pitch spacing

Headers, Male Pins Applications

• General purpose electronic interconnects
• Board-to-board connections
• Peripheral interface modules

Headers, Male Pins Procurement Notes

Verify the specific suffix Z22MP1 against the manufacturer's official datasheet to confirm pin count, plating specifications, and mounting orientation. Ensure compatibility with standard surface mount reflow profiles and check for any RoHS compliance documentation required for your assembly process.

Headers, Male Pins Selection Notes

Select this component when a low-profile, right-angle male header is required for surface mount applications. The 2.54 mm pitch ensures compatibility with standard ribbon cables and dupont-style connectors. Consider the mechanical height constraints of the enclosure and the need for perpendicular signal routing.

Headers, Male Pins Part Context

This part belongs to the A-SL series of pin headers from Assmann WSW. The series offers various configurations including straight and right-angle options in both through-hole and surface mount formats. The 22-position variant provides a balanced solution for moderate density interconnect needs within compact electronic assemblies.

Headers, Male Pins Replacement Considerations

Direct substitutes must match the 22-pin count, 2.54 mm pitch, right-angle orientation, and surface mount termination type. Verify that alternative manufacturers offer identical mechanical dimensions and compatible soldering profiles to ensure seamless integration without redesigning the footprint.