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A-WBP-B001EG-13SR01 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Assmann WSW Components. Its product description is WIRE-TO-BOARD, WAFER, 1.00MM, 13. Review the specifications below when checking this part for your BOM.
The A-WBP-B001EG-13SR01 is a wire-to-board wafer connector header manufactured by Assmann WSW Components. It features a 13-position configuration with a 1.00mm (0.039 inch) pitch. The component utilizes surface mount, right-angle termination for PCB integration. Contact materials are brass with gold plating to ensure reliable signal transmission and corrosion resistance. The housing is constructed from thermoplastic insulation rated for high temperatures.
Verify the specific suffix SR01 against the manufacturer's current datasheet to confirm packaging details and tape-and-reel specifications. Ensure the right-angle orientation matches the assembly requirements. Cross-reference the RoHS compliance status with the latest environmental declarations provided by Assmann WSW Components prior to finalizing procurement orders.
Select this component when a low-profile, right-angle surface mount header is required for tight spatial constraints. The 1.00mm pitch suits applications needing high pin counts in limited areas. Verify that the mating connector aligns with the 13-position requirement and compatible contact geometry for secure engagement.
This part belongs to the A-WBP series of wafer connectors designed for wire-to-board applications. Assmann WSW Components specializes in standard and custom interconnect solutions. This specific model represents a surface mount variant within their portfolio of precision electronic connectors.
Direct substitutes must match the 13-position count, 1.00mm pitch, and right-angle surface mount form factor. Verify compatibility with existing mating cables or headers. Consult distributor cross-reference tools for equivalent parts from other manufacturers if supply chain adjustments are necessary.
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