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A-WBP-D002EG-13TB01 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Assmann WSW Components. Its product description is WIRE-TO-BOARD, WAFER, 1.25MM, 13. Review the specifications below when checking this part for your BOM.
The A-WBP-D002EG-13TB01 is a wire-to-board header manufactured by Assmann WSW Components. It features a 13-position configuration with male pins and a 1.25mm (0.049 inch) pitch. The connector utilizes through-hole right-angle mounting for secure board attachment. The housing is constructed from polyamide (PA66), offering UL94 V-0 flammability rating. Contact surfaces are tin-plated brass, ensuring reliable electrical conductivity. Rated voltage is 125VAC/DC.
Verify the specific pin count and pitch against schematic requirements before ordering. Confirm that the right-angle orientation matches the mechanical layout constraints of the target printed circuit board assembly. Ensure compatibility with mating wire harness connectors regarding contact retention force and insulation displacement specifications.
Select this component when a low-profile, right-angle connection is required for 1.25mm pitch applications. Consider the 125VAC/DC voltage rating and current carrying capacity limits relative to the application load. Evaluate the through-hole termination method against available PCB fabrication capabilities and mechanical stress requirements during assembly.
This part belongs to the A-WBP series of wire-to-board headers from Assmann WSW Components. The series offers various position counts and pitch options, including 1.25mm and 2.54mm variants. These connectors are designed for general-purpose electronic interconnects, providing a balance of electrical performance and mechanical reliability for mass production environments.
Direct substitutes include other 13-position, 1.25mm pitch right-angle headers from manufacturers such as Molex or JST, provided they match the pin configuration and mounting style. Verify dimensional tolerances and contact plating specifications to ensure functional interchangeability without redesigning the PCB footprint.
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