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A-WBP-D004EG-09TB01 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Assmann WSW Components. Its product description is WIRE-TO-BOARD, WAFER, 1.25MM, 9P. Review the specifications below when checking this part for your BOM.
The A-WBP-D004EG-09TB01 is a wire-to-board wafer header manufactured by Assmann WSW Components. It features a 9-position configuration with a 1.25 mm pitch, designed for through-hole termination. The connector utilizes brass contacts with tin plating and a polyamide (PA66) insulation material rated UL94 V-0. It supports a maximum current of 3A and operates within a temperature range of -40°C to 105°C.
Verify the specific part number against official manufacturer documentation to ensure compatibility with mating connectors. Confirm that the 1.25 mm pitch and 9-position count match the target PCB footprint. Check for RoHS compliance status if required by project specifications. Ensure the through-hole termination method aligns with the assembly process capabilities.
Select this component when a low-profile, high-density connection is required for signal or low-power applications. The 1.25 mm pitch allows for compact board layouts compared to standard 2.54 mm headers. Consider the 3A current rating and 105°C operating limit to ensure performance under expected load conditions. Verify mechanical retention requirements for the through-hole mounting style.
This component belongs to the A-WBP series of wire-to-board connectors from Assmann WSW Components. The series offers various pitch options and position counts to accommodate diverse interconnect needs. The D004EG suffix typically denotes specific housing and contact configurations within the product line, ensuring standardized dimensions for mating pairs.
Direct substitutes must maintain the 1.25 mm pitch, 9-position count, and through-hole termination. Verify that alternative manufacturers offer compatible tin-plated brass contacts and UL94 V-0 insulation. Cross-reference mechanical drawings to ensure identical housing dimensions and pin spacing for seamless integration.
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