A-WBP-D006EG-13SR01

Headers, Male Pins Overview

The A-WBP-D006EG-13SR01 is a wire-to-board header assembly manufactured by Assmann WSW Components. It features 13 positions arranged in a single row with a 1.25 mm (0.049 inch) pitch. The component utilizes a wafer header design intended for surface mount technology (SMT) applications. This connector provides a reliable electrical interface for board-level interconnections.

Headers, Male Pins Feature Summary

• Surface mount wafer header design
• 13-position configuration
• 1.25 mm pitch spacing

Headers, Male Pins Applications

• Wire-to-board interconnections
• Surface mount circuit assemblies
• Consumer electronics manufacturing

Headers, Male Pins Procurement Notes

Verify the specific suffix and orientation against the official datasheet to ensure compatibility with the target PCB footprint. Confirm that the surface mount termination type matches the assembly process requirements. Check for any RoHS compliance documentation if environmental regulations apply to the final product integration.

Headers, Male Pins Selection Notes

Select this component when a low-profile, surface-mounted solution is required for 13-wire connections. The 1.25 mm pitch allows for dense board layouts compared to standard 2.54 mm headers. Ensure the design accommodates the specific wafer form factor and SMT reflow profile limitations defined by the manufacturer.

Headers, Male Pins Part Context

This part belongs to the A-WBP series of wafer headers from Assmann WSW Components. These connectors are designed for high-density applications where space constraints limit the use of through-hole alternatives. The series offers various position counts while maintaining consistent pitch and mounting characteristics.