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A-WBP-L001EG-14TB01 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Assmann WSW Components. Its product description is WIRE-TO-BOARD, WAFER, 2.50MM, 14. Review the specifications below when checking this part for your BOM.
The A-WBP-L001EG-14TB01 is a wire-to-board wafer connector manufactured by Assmann WSW Components. It features a 14-position header with a 2.54mm (0.100 inch) pitch. The component utilizes through-hole, right-angle termination for PCB mounting. Contact materials consist of brass with tin plating to ensure reliable conductivity and corrosion resistance. The housing is constructed from polyamide (PA66), rated UL94 V-0 for flammability. It supports a rated current of 3A and a voltage of 250VAC/DC, operating within a temperature range of -40°C to 105°C.
Verify the specific suffix TB01 against the manufacturer's latest datasheet to confirm packaging and tape/reel specifications. Ensure compatibility with mating connectors regarding keying orientation and pin count. Check for RoHS compliance status if required by project regulations. Confirm lead times as these components are often made-to-order.
Select this model when a 14-position, right-angle header with 2.54mm pitch is required. Ensure the application environment stays within the -40°C to 105°C operating range. Verify that the 3A current rating and 250V voltage limit meet circuit requirements. Consider the keying slot feature if anti-mating error protection is necessary.
This part belongs to the A-WBP series of wire-to-board connectors from Assmann WSW Components. The series focuses on standard pitch interconnects for flat cable and wire applications. Similar parts in the family vary primarily by position count and housing color, sharing common electrical ratings and mechanical termination styles.
No direct public substitute part numbers are confirmed for this specific model. Generic equivalents may exist but require verification of pitch, current rating, and keying dimensions to ensure functional compatibility.
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