A-WBP-L004EG-12SR01

Headers, Male Pins Overview

The A-WBP-L004EG-12SR01 is a surface mount connector header manufactured by Assmann WSW Components. It features 12 positions with a 2.50mm (0.098 inch) pin spacing. The component is designed for board-to-board connections using a straight, single-row configuration. It utilizes a gold-plated contact finish to ensure reliable signal transmission and corrosion resistance. The housing material provides structural integrity for surface mounting applications.

Headers, Male Pins Feature Summary

• Surface mount technology design for automated PCB assembly
• Single-row straight header configuration
• Gold-plated contacts for enhanced conductivity
• Standard 2.50mm pitch spacing

Headers, Male Pins Applications

• Consumer electronics internal interconnects
• Industrial control board assemblies
• Telecommunications equipment modules
• General-purpose circuit board connections

Headers, Male Pins Procurement Notes

Verify the specific manufacturer datasheet to confirm mechanical dimensions and mating partner compatibility. Ensure the selected variant matches the required current rating and voltage specifications for the target application environment. Cross-reference the official part number to distinguish between different plating options or housing colors if available in the product line.

Headers, Male Pins Selection Notes

Select this component when a low-profile, surface-mounted solution is required for high-density connections. The 2.50mm pitch offers a balance between connection density and manufacturing tolerance. Consider the straight orientation for standard vertical stacking. Verify that the PCB footprint aligns precisely with the manufacturer's recommended land pattern for optimal solder joint reliability.

Headers, Male Pins Part Context

This part belongs to the A-WBP series of surface mount headers from Assmann WSW Components. The series provides various position counts and pitch options to support diverse electronic assembly needs. The 12-position variant serves as a specific node within this broader family, offering standardized connectivity for compact device designs requiring reliable electrical pathways.