A-WBP-L008EG-09TB01

Headers, Male Pins Overview

The A-WBP-L008EG-09TB01 is a wire-to-board header manufactured by Assmann WSW Components. It features a 9-position configuration with a 2.50mm (0.098 inch) pitch. The component utilizes through-hole mounting technology for secure PCB attachment. This connector is designed for reliable electrical interconnection in various electronic assemblies.

Headers, Male Pins Feature Summary

• Supports through-hole mounting for stable PCB integration
• Features a 2.50mm pitch for standard spacing requirements
• Provides a 9-position interface for multi-signal connections

Headers, Male Pins Applications

• General-purpose electronic circuit boards
• Consumer electronics internal wiring
• Industrial control module interconnections

Headers, Male Pins Procurement Notes

Verify the exact pin count and pitch against design schematics before ordering. Confirm that the through-hole package dimensions match the printed circuit board layout. Ensure compatibility with mating connectors from the same product family to guarantee proper mechanical fit and electrical continuity.

Headers, Male Pins Selection Notes

Select this component when a 9-position, 2.50mm pitch header is required. Consider the through-hole mounting style for applications needing robust mechanical stability. Evaluate space constraints on the PCB to ensure adequate clearance for the connector profile and adjacent components during assembly.

Headers, Male Pins Part Context

This part belongs to the A-WBP series of wire-to-board connectors from Assmann WSW Components. The series offers various position counts and pitch options. The specific model provides a standardized solution for connecting wires to rigid substrates in compact electronic designs.

Headers, Male Pins Replacement Considerations

Check for direct substitutes within the A-WBP series offering identical 9-position and 2.50mm pitch specifications. Verify that any alternative maintains the same through-hole mounting characteristics and physical footprint to ensure seamless integration without redesigning the host PCB.