SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Hoffman A1210CHFTC is a Type 12 steel junction box with dimensions of 12 inches in height, 10 inches in width, and 5.75 inches in depth. Constructed from 16-gauge steel with an ANSI 61 gray polyester powder paint finish, it features a continuous hinge cover and an external formed flange trough collar designed to channel away liquids. The enclosure utilizes heavy-duty, tool-to-open plated latches for secure closure and includes bonding provisions on the door.
Verify the exact depth specification, as sources cite both 5.75 inches and 6 inches. Confirm that the ANSI 61 gray color matches project requirements. Ensure the 16-gauge steel thickness meets structural needs. Check for specific UL 50/50E listing documentation if required for compliance. Validate the continuous hinge configuration against space constraints.
Select this model when a NEMA 12 rated enclosure with a flange trough collar is required for liquid management. The 12x10 inch footprint suits compact control panels. The tool-to-open latch mechanism provides enhanced security compared to quarter-turn alternatives. The continuous hinge offers durability for frequent access scenarios.
This component belongs to the Hoffman Enclosures line of metallic junction boxes. It is part of a series featuring flange trough collars for specific environmental protection needs. The product is manufactured by nVent Hoffman, specializing in industrial enclosure solutions.
No public confirmed substitute part numbers are available in the provided data.

On September 22nd, it was reported that Samsung Electronics, the South Korean tech giant, had successfully passed NVIDIA’s certification test for its 12-layer HBM3E…
Read More
What Is NAND Flash? A Practical Guide for Engineers & Procurement Teams In today’s data-driven world—from smartphones and SSDs to industrial IoT devices—NAND flash…
Read More
Recently, the global electronic component market has witnessed a series of new developments. The strategic layouts and market collaborations of major enterprises are constantly…
Read More
Manchester, New Hampshire, USA – March 22, 2026 – Allegro MicroSystems, Inc. (Nasdaq: ALGM), a global leader in high-performance power and sensing semiconductor solutions…
Read More
In an era dominated by AI accelerators with terabytes of HBM memory and consumer devices racing toward LPDDR5X bandwidth, it’s easy to wonder: why…
Read More
Learn how rectifiers convert AC to DC, compare half-wave and bridge circuits, and select voltage, current, recovery and thermal ratings for your design.
Read More
TOKYO — Global leading semiconductor and power electronic components manufacturer Renesas Electronics officially issued a new price adjustment notice in early September 2026, confirming…
Read More
Tempe, Arizona‑based semiconductor giant Microchip Technology has formally rolled out selective product price increases across its MCU, power‑management IC, memory controller and analog component…
Read More
Compare thermistors, RTDs, thermocouples and temperature ICs. Learn how range, accuracy, response, interfaces and mounting affect component selection.
Read More
The multilayer ceramic capacitor (MLCC) market has fallen into a severe structural supply crunch in the third quarter of 2026, driven by explosive demand…
Read More
Recently, the global electronic components market has been constantly evolving, and different regions and enterprises have witnessed new moves in aspects such as technological…
Read More
Recently, a survey by the Electronic Components Industry Association (ECIA) revealed that the sales sentiment of global electronic components remained optimistic in the third…
Read More