SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Hoffman Enclosures A30R3016NK is a C-style steel enclosure rated NEMA 3R and IP32. It measures 30 inches in height, 30 inches in width, and 16 inches in depth. The unit features a slip-on removable cover secured by plated steel screws along the bottom edge. Constructed from galvanized steel with a polyester powder-coated ANSI 61 gray finish, it includes embossed mounting holes on the back panel for wall installation.
Verify that the specific order matches the A30R3016NK designation to ensure correct dimensions of 30x30x16 inches. Confirm the material specification requires galvanized steel with a polyester powder-coated finish. Ensure the application environment aligns with the NEMA 3R and IP32 ratings for outdoor or wet location suitability. Check for any required accessories not included in the standard enclosure assembly.
Select this model when a large footprint enclosure with significant depth is required for extensive wiring or component placement. The NEMA 3R rating makes it suitable for outdoor use where protection from rain and sleet is necessary. Consider the weight implications of the 16-gauge galvanized steel construction for wall support requirements. Verify that the screw-cover mechanism meets maintenance access needs compared to hinged alternatives.
This part belongs to the Hoffman C-Style series of commercial enclosures. These units are designed for general-purpose industrial applications requiring durable metal housings. The series offers various sizes and configurations to accommodate different equipment footprints while maintaining consistent mounting standards and environmental protection levels across the product line.
No public confirmed substitute part numbers are available.

Geneva, Switzerland – August 20, 2026 – Global leading semiconductor manufacturer STMicroelectronics (ST) has officially issued a new global price adjustment notice to global…
Read MoreLas Vegas, January 6, 2026 — At the Consumer Electronics Show (CES) 2026, Texas Instruments (TI) (NASDAQ: TXN) announced a suite of next-generation semiconductor…
Read More
Recently, the global electronic component market has witnessed a series of new developments. The strategic layouts and market collaborations of major enterprises are constantly…
Read More
In the embedded world, general-purpose CPUs are great at running operating systems, and MCUs excel at logic control. But when you need to process…
Read More
Recently, a survey by the Electronic Components Industry Association (ECIA) revealed that the sales sentiment of global electronic components remained optimistic in the third…
Read More
In embedded design, the tug-of-war between cost and performance is constant. On one side, you have Microcontrollers (MCUs)—cheap, simple, and efficient. On the other,…
Read More
Find out when a bare shock switch needs a pull resistor, when an MCU internal pull-up is enough, and why sensor modules and piezo…
Read More
TOKYO, April 15, 2026 – Taiyo Yuden Co., Ltd. (TAIYO YUDEN), a leading global manufacturer of passive electronic components, has officially notified its worldwide…
Read More
Stay ahead with ChipApex Insights — technical deep dives, market trends, and sourcing tips for memory, microcontrollers, power management, and industrial-grade components. Trusted by…
Read More
Munich, Germany – May 26, 2026 – Power semiconductor and automotive chip giant Infineon Technologies AG has formally notified customers worldwide of a second…
Read More
Select power transformers by input frequency, secondary VA, rectifier load, isolation, regulation and inrush. Build a clearer specification for your next RFQ.
Read More
Tempe, Arizona‑based semiconductor giant Microchip Technology has formally rolled out selective product price increases across its MCU, power‑management IC, memory controller and analog component…
Read More