SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Hoffman Enclosures A363006LP is a wall-mount enclosure constructed from mild steel with a gray finish. Its dimensions are 36.00 inches in length, 30.00 inches in width, and 6.00 inches in depth (914.40 mm x 762.00 mm x 152.40 mm). The unit features a single door secured by screw-down clamp latches on a continuous hinge. It carries NEMA Type 12 and 13 ratings, along with UL 508A, CUL, and CSA C22.2 approvals.
Verify the specific model suffix to ensure compatibility with required mounting configurations and environmental ratings. Confirm that the mild steel construction meets corrosion resistance requirements for the intended indoor environment. Cross-reference approval marks such as UL 508A against local regulatory standards before deployment.
Select this model when a robust, heavy-duty enclosure is needed for indoor applications requiring dust-tight and drip-proof protection. The continuous hinge offers superior durability compared to standard hinges. Ensure the internal volume accommodates all necessary components while allowing for adequate airflow and serviceability within the fixed depth constraints.
This component belongs to the Hoffman line of metal enclosures designed for industrial environments. It provides standardized dimensions compatible with common panel layouts. The product series emphasizes durability through welded seams and formed flanges, catering to sectors requiring reliable hardware protection against particulate ingress.
Direct substitutes include models with identical external dimensions and rating classes. Verify hinge type and latch mechanism compatibility if swapping brands. Ensure replacement units maintain equivalent UL and CSA certifications for regulatory compliance.

Embedded Integrated Circuit Modules: The Backbone of Modern Technology Embedded Integrated Circuit Modules (EICMs) have become an indispensable part of modern technology. Serving as…
Read More
Understand RF attenuator dB values, fixed and programmable types, impedance, power limits and noise tradeoffs before choosing parts for an RF signal path.
Read More
TOKYO, April 15, 2026 – Taiyo Yuden Co., Ltd. (TAIYO YUDEN), a leading global manufacturer of passive electronic components, has officially notified its worldwide…
Read More
Select a bridge rectifier by reverse voltage, capacitor charging current, startup surge and cooling. Work through a stated DC voltage and ripple example.
Read More
Manchester, New Hampshire, USA – March 22, 2026 – Allegro MicroSystems, Inc. (Nasdaq: ALGM), a global leader in high-performance power and sensing semiconductor solutions…
Read More
Recently, the global electronic component market has witnessed a series of new developments. The strategic layouts and market collaborations of major enterprises are constantly…
Read More
Choose a DIP switch by contact type, coded positions, footprint and signal ratings. Check logic polarity, assembly conditions and PCB configuration behavior.
Read MoreTOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication…
Read MoreLatest updates from leading semiconductor manufacturers: Wolfspeed launches new SiC modules, AMD reveals MI430X with HBM4, TSMC eyes third Japan fab, and Samsung samples…
Read More
Compare thermistors, RTDs, thermocouples and temperature ICs. Learn how range, accuracy, response, interfaces and mounting affect component selection.
Read More
Recently, the global electronic component market has witnessed complex and changeable trends. In the memory chip sector, the wave of price increases continues to…
Read More
Explore electronic component types, functions, packages and datasheets. Learn selection, replacement and BOM checks before ordering parts for your PCB.
Read More