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A5EC013BB23AI6X is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Altera. Its product description is FPGA AGILEX 5E 138KLE 839VPBGA. Review the specifications below when checking this part for your BOM.
The Altera A5EC013BB23AI6X is a System on Chip FPGA belonging to the Agilex 5 E-Series. It integrates an FPGA fabric with embedded ARM Cortex processors, specifically featuring dual-core ARM Cortex-A55 MPCore and dual-core ARM Cortex-A76 cores equipped with CoreSight technology. The device provides 138K logic elements and supports operating frequencies of up to 1.5GHz for the A55 cores and 1.8GHz for the A76 cores. It includes 512kB of RAM and offers 400 I/Os within a 795-VPBGA (23x23) package. The component operates within a junction temperature range of -40°C to 100°C.
Verify the specific suffix 'X' against official Intel/Altera documentation to confirm if it denotes a specific tape-and-reel or tray configuration variant, as standard listings often default to tray packaging. Confirm moisture sensitivity level (MSL 3) handling requirements during assembly. Ensure compatibility with the Agilex 5 development tools and licensing models before procurement.
Select this model when a balance of high-performance application processing via Cortex-A76 and efficient background task handling via Cortex-A55 is required within a compact footprint. Compare against the A5EA013BB23BI6S for potential package or temperature range differences. Consider the 138KLE density relative to larger 656KLE options if resource scaling is anticipated.
This part belongs to the Agilex 5 E-Series, which targets power-efficient edge applications. The series emphasizes performance-per-watt improvements over previous 16nm nodes and Cyclone V devices. It utilizes the second-generation Hyperflex FPGA architecture and includes AI Tensor Blocks for INT8 inference support.
Publicly confirmed substitute part numbers are not available in the provided data. Evaluate other Agilex 5 E-Series variants such as A5EA013BB23BI6S for pin-to-pin or functional compatibility based on specific package and temperature grade requirements.
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