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ACS770ECB-200B-PSF-T is listed in the Current Sensors range at ChipApex. The manufacturer field lists Allegro MicroSystems. Its product description is FOR NEW DESIGNS USE ACS772/3. Review the specifications below when checking this part for your BOM.
The ACS770ECB-200B-PSF-T is a fully integrated Hall-effect current sensor designed for board-mount applications. It features a bidirectional measurement capability with a rated current of 200A and a sensitivity of 10mV/A. The device operates on a 5V supply voltage, ranging from 4.5V to 5.5V, and delivers an analog output. It exhibits a response time of 4.6µs and supports a bandwidth up to 120kHz. The component is housed in a 5-CB formed lead package (PFF) and complies with AEC-Q100 automotive standards.
Verify the specific suffix PSF against the official Allegro datasheet to confirm the package type and pin configuration match the target PCB footprint. Ensure the bidirectional variant aligns with system requirements, as unidirectional options exist within the same series. Confirm RoHS compliance status and moisture sensitivity level prior to assembly planning.
Select this model when bidirectional current sensing is required for high-current applications up to 200A. The 10mV/A sensitivity provides a measurable output signal for standard ADC interfaces. Consider the thermal performance of the 5-CB package and ensure adequate copper area on the PCB for current carrying capacity and heat spreading.
This component belongs to the ACS770 series of current sensors from Allegro MicroSystems. The series offers various current ratings and package options tailored for automotive and industrial environments. The ECB designation typically indicates specific internal circuit enhancements or packaging variations within the broader product family.
Direct substitutes include other variants within the ACS770 series such as ACS770ECB-200U-PSF-T for unidirectional applications or different current ratings like ACS770LCB-100B-PFF-T. Verify that any replacement matches the bidirectional requirement, sensitivity, and package dimensions.
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