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ADG782BCPZ is listed in the Analog Switches, Multiplexers, Demultiplexers range at ChipApex. The manufacturer field lists Analog Devices Inc.. Its product description is IC SWITCH SPST-NOX4 4OHM 20LFCSP. Review the specifications below when checking this part for your BOM.
The ADG782BCPZ is a monolithic CMOS device containing four independently selectable SPST switches in a 20-lead 4 mm x 4 mm chip scale package. It operates on a single supply voltage ranging from 1.8 V to 5.5 V. The device features low on-resistance with a typical value of 5 Ω and maximum of 10 Ω at 3.3 V, ensuring low signal attenuation. It provides rail-to-rail operation, high bandwidth exceeding 200 MHz, and fast switching times with tON typically at 13 ns and tOFF at 7 ns. Power consumption is minimal, with typical supply current below 1 μA.
Verify the specific ordering suffix to confirm packaging format. The standard tape-and-reel option uses the -REEL7 suffix, while bulk units may use different designations. Confirm RoHS compliance status indicated by the Z suffix. Ensure the temperature grade matches the B version specification for industrial range requirements before finalizing procurement orders.
Select the ADG782BCPZ when four independent SPST switches are required without multiplexing functionality. Unlike the ADG783, this model does not support break-before-make timing, making it unsuitable for direct multiplexer configurations where channel shorting must be prevented. Choose this variant for general-purpose signal routing where independent control of each channel is necessary.
The ADG782BCPZ belongs to the ADG781/ADG782/ADG783 family of quad SPST switches. It shares identical electrical specifications and pinouts with the ADG781 and ADG783 but differs in internal logic configuration. The ADG781 offers complementary inputs, while the ADG783 includes break-before-make timing for multiplexer use. All three share the same 20-lead LFCSP package and operational characteristics.
The ADG711 and ADG712 are functionally equivalent devices available in 16-lead TSSOP and SOIC packages. These alternatives provide similar electrical performance but require footprint adaptation due to the different package outline and pin count compared to the 20-lead chip scale package of the ADG782BCPZ.
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