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ADG787BCPZ-500RL7 is listed in the Analog Switches, Multiplexers, Demultiplexers range at ChipApex. The manufacturer field lists Analog Devices Inc.. Its product description is IC SWITCH SPDT X 2 3OHM 10LFCSP. Review the specifications below when checking this part for your BOM.
The ADG787BCPZ-500RL7 is a low voltage CMOS device containing two independently selectable single-pole, double-throw (SPDT) switches. Designed for USB 1.1 signal switching and general analog-to-digital applications, it operates on a single supply from 1.8 V to 5.5 V. The component features a typical on resistance of 2.5 Ω and a -3 dB bandwidth of 150 MHz. It exhibits break-before-make switching action with minimal charge injection. The part is housed in a 10-lead Lead Frame Chip Scale Package (LFCSP) and supports an extended industrial temperature range of -40°C to +85°C.
Verify the specific ordering suffix to confirm the package type and reel quantity. Ensure the temperature grade matches the application requirements. Confirm RoHS compliance status during procurement. Check for lead-free soldering compatibility if required by assembly processes. Validate pin configurations against the target PCB footprint.
Select this component when dual SPDT switching is required within tight spatial limits. Consider the low on resistance for minimizing signal distortion in audio or video paths. Evaluate the single-supply operation capability against available system voltages. Assess the thermal performance based on the LFCSP package characteristics.
This part belongs to the ADG787 series of low voltage analog switches. It shares functional similarities with other devices in the family but differs in packaging options such as MSOP and WLCSP. The B version denotes the extended industrial temperature rating. The CPZ suffix specifically identifies the Lead Frame Chip Scale Package variant.
Direct substitutes include ADG787BRMZ-500RL7 and ADG787BCBZ-500RL7. Verify pinout compatibility before substitution. Ensure the alternative package maintains the required thermal and mechanical constraints.
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