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ADS1288IRHBR is listed in the Analog To Digital Converters (ADC) range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is Low-power, 32-bit two-channel. Review the specifications below when checking this part for your BOM.
The Texas Instruments ADS1288IRHBR is a 32-bit, low-power delta-sigma analog-to-digital converter (ADC) designed for seismic applications. It features two differential input channels with an integrated programmable gain amplifier (PGA) offering gains from 1 to 64, and a unity-gain buffer mode. The device supports data rates ranging from 125 SPS to 2000 SPS and includes a flexible digital filter system comprising sinc, FIR, and IIR filters. Power consumption is typically 5 mW in PGA operation and 3 mW in buffer operation at 3.3 V. It operates over an ambient temperature range of –40°C to +85°C and is housed in a 32-pin, 5 mm × 5 mm VQFN package.
Verify the specific IRHBR suffix against the manufacturer's current orderable information to confirm the reel packaging configuration. Ensure that the required voltage reference components and external capacitors match the datasheet recommendations for stable operation within the specified electrical limits.
Select this component when high-resolution seismic data acquisition is required alongside strict power constraints. The integrated PGA eliminates the need for external amplifiers for direct geophone connection. Verify that the required data rate falls within the 125 SPS to 2000 SPS operational window and that the 32-bit resolution meets the dynamic range requirements.
The ADS1288 belongs to the Texas Instruments ADS128x family of precision ADCs tailored for seismology. This series emphasizes low noise and low power consumption to support battery-operated field deployment. The device integrates specialized features like clock error compensation and multi-stage digital filtering to handle the specific signal processing demands of seismic sensors.
The ADS1288IPWR is a pin-compatible alternative available in a TSSOP-28 package. Designers must evaluate thermal performance differences between the VQFN and TSSOP packages and verify that the pin count reduction does not impact existing board layout constraints.
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