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ADS8509IBDBG4 is listed in the Analog To Digital Converters (ADC) range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC ADC 16BIT SAR 28SSOP. Review the specifications below when checking this part for your BOM.
The ADS8509IBDBG4 is a single-channel, 16-bit successive approximation register (SAR) analog-to-digital converter manufactured by Texas Instruments. It operates with a sampling rate of 250 kSPS and supports both single-ended input configurations. The device functions within an analog and digital supply voltage range of 4.75 V to 5.25 V. Key performance metrics include a signal-to-noise ratio of 88 dB, differential nonlinearity of ±1 LSB, and integral nonlinearity of ±2 LSB. It features an internal or external reference option and communicates via an SPI interface. The component is housed in a 28-SSOP package and is rated for operation between -40°C and +85°C.
Verify the specific suffix G4 indicates RoHS compliance and lead-free status as per manufacturer standards. Confirm the IB designation corresponds to the industrial temperature range specifications. Ensure the SSOP-28 package dimensions match the target PCB footprint requirements before finalizing procurement orders.
Select this component when a single-channel, 16-bit resolution is required at speeds up to 250 kSPS. It is suitable for designs needing an integrated oscillator and daisy-chain capability. Consider the 28-SSOP package constraints and the 5V supply requirement. Verify if the internal reference meets noise specifications or if an external reference is necessary for optimal SNR performance.
This part belongs to the ADS8509 family of high-speed, low-power ADCs from Texas Instruments. It shares architectural similarities with other members like the ADS8508 and ADS8519 but differs in resolution and pinout compatibility. The IBDBG4 variant specifically denotes the industrial grade temperature range and the SSOP-28 surface-mount package type.
The ADS8509IBDWG4 serves as a pin-compatible alternative in a different SOIC-20 package. Designers must account for the physical footprint change and verify that the board layout accommodates the alternative package dimensions without modifying existing traces.
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