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ADS8860IDRCT is listed in the Analog To Digital Converters (ADC) range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC ADC 16BIT SAR 10VSON. Review the specifications below when checking this part for your BOM.
The ADS8860IDRCT is a single-channel, 16-bit successive approximation register (SAR) analog-to-digital converter manufactured by Texas Instruments. It operates with an analog supply voltage ranging from 2.7 V to 3.6 V and a digital supply voltage from 1.65 V to 3.6 V. The device supports sampling rates up to 1 MSPS and features a pseudodifferential or single-ended input architecture. Key performance metrics include a signal-to-noise ratio of 93 dB and a signal-to-noise and distortion ratio of 92.9 dB. Power consumption is specified at 5.5 mW. It utilizes an external reference and communicates via an SPI interface within an operating temperature range of -40°C to +85°C.
Verify the specific suffix IDRCR against the official datasheet to confirm the tape-and-reel packaging configuration and pinout compatibility. Ensure that the external voltage reference selected meets the required accuracy specifications for the target application. Confirm moisture sensitivity level handling procedures during assembly to prevent package damage.
Select this component when a high-resolution 16-bit conversion speed of 1 MSPS is required in a minimal footprint. Compare power consumption figures against lower-speed variants if battery life is critical. Verify that the input signal range aligns with the available external reference voltage options provided by the system design.
This part belongs to the microPOWER family of data converters from Texas Instruments. It shares architectural similarities with the ADS8861 and ADS8866 but differs in input type and sampling rate specifications. The IDRCR suffix specifically denotes the VSON-10 surface-mount package variant designed for automated surface-mount assembly processes.
The ADS8860IDGSR serves as a pin-compatible alternative utilizing a VSSOP-10 package. Designers must verify thermal dissipation characteristics and physical board space constraints when substituting between these package types.
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