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APT6017B2LLG is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Microsemi Corporation. Its product description is MOSFET N-CH 600V 35A T-MAX. Review the specifications below when checking this part for your BOM.
The APT6017B2LLG is a Power Field-Effect Transistor manufactured by Microsemi Corporation. It is an N-Channel Silicon Metal-Oxide Semiconductor FET housed in the TMAX-3 package. The device features a single element configuration with a built-in diode and operates in enhancement mode. Key electrical parameters include a maximum drain current of 35 A, a minimum drain-source breakdown voltage of 600 V, and a maximum drain-source on-resistance of 0.17 ohms. The avalanche energy rating is specified at 1600 mJ. The component supports a maximum operating temperature of 150 °C.
Verify the specific suffix 'G' against official Microsemi documentation to confirm if it denotes a lead-free or RoHS-compliant variant, as standard listings may indicate non-RoHS status. Ensure the TMAX-3 package dimensions match the target PCB footprint requirements before procurement. Confirm that the 600V rating aligns with the system's peak voltage stresses.
Select this component when a 600V N-channel MOSFET with low on-resistance is required for high-current applications up to 35A. The integrated diode simplifies circuit design by eliminating the need for external freewheeling diodes in certain configurations. Consider the thermal management capabilities of the TMAX-3 package for the intended heat dissipation environment.
This part belongs to the Microsemi (formerly Aptex) power MOSFET family, specifically designed for high-voltage switching applications. The TMAX-3 package is a through-hole option suitable for industrial and commercial power supplies. The product line emphasizes reliability and performance in demanding electrical environments.
Consult official Microsemi substitution guides for verified equivalents. Generic replacements must match the 600V rating, 35A current capacity, and 0.17 ohm resistance while maintaining compatible pinout and package dimensions.
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