Memory IC AS4C32M16D1A-5TCN product image

AS4C32M16D1A-5TCN

$3.49
  • Description:IC DRAM 512MBIT PAR 66TSOP II
  • Series:-
  • Mfr:Alliance Memory, Inc.
  • Package:Tray

SKU:367c3e9e2379 Category: Brand:

  
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AS4C32M16D1A-5TCN is listed in the Memory IC range at ChipApex. The manufacturer field lists Alliance Memory, Inc.. Its product description is IC DRAM 512MBIT PAR 66TSOP II. Review the specifications below when checking this part for your BOM.

Memory IC specifications for AS4C32M16D1A-5TCN

  • Description:IC DRAM 512MBIT PAR 66TSOP II
  • Series:-
  • Mfr:Alliance Memory, Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR
  • Memory Size:512Mbit
  • Memory Organization:32M x 16
  • Memory Interface:Parallel
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:2.3V ~ 2.7V
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:66-TSSOP (0.400", 10.16mm Width)
  • Supplier Device Package:66-TSOP II
  • Access Time:700 ps
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for AS4C32M16D1A-5TCN

AS4C32M16D1A-5TCN

Memory IC Overview

The AS4C32M16D1A-5TCN is a 512 Mbit (32 M x 16) DDR SDRAM component manufactured by Alliance Memory. It operates with a maximum clock frequency of 200 MHz and features a 700 ps access time. The device utilizes a 66-pin TSOP-II package for surface mount installation. Electrical specifications include a supply voltage range of 2.3 V to 2.7 V and a maximum power current of 90 mA. It supports commercial temperature operation from 0°C to +70°C.

Memory IC Feature Summary

  • Supports Double Data Rate synchronous dynamic random access memory architecture for high-speed data transfer.
  • Integrates on-chip burst prefetch architecture to enhance internal memory array speed relative to external interface speed.
  • Features differential clock inputs and data strobes for improved signal integrity and timing accuracy.

Memory IC Applications

  • Embedded systems requiring moderate capacity DRAM solutions
  • Industrial control equipment operating within commercial temperature ranges
  • Consumer electronics utilizing surface-mount technology constraints

Memory IC Procurement Notes

Verify the specific suffix TCN confirms the 66-pin TSOP-II package and commercial temperature grade against official datasheets. Confirm RoHS compliance status through manufacturer documentation prior to integration. Ensure design compatibility with 2.5V I/O levels and 2.3V to 2.7V core voltage requirements. Validate humidity sensitivity handling procedures during assembly.

Memory IC Selection Notes

Select this component when a 512 Mbit density with 16-bit width is required in a TSOP-II form factor. Compare performance metrics such as 200 MHz speed and 700 ps latency against alternative packages like BGA if space permits. Evaluate thermal management needs for commercial grade environments. Consider pin count and board layout constraints associated with the 66-pin configuration.

Memory IC Part Context

This part belongs to the AS4C32M16D1A series of DDR SDRAM devices from Alliance Memory. The series offers various speed grades and packaging options including TSOP and BGA formats. The -5TCN designation specifically identifies the 200 MHz speed bin, commercial temperature range, and TSOP-II 66-pin physical package variant within this product line.

Memory IC Replacement Considerations

Check for other speed grades within the AS4C32M16D1A series or different package types from the same manufacturer. Verify electrical and mechanical compatibility before substituting with parts from other vendors offering equivalent 512Mb DDR SDRAM specifications.

AS4C32M16D1A-5TCNAS4C32M16D1A-5TCN
$3.49
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