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AUIRFSL6535 is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists International Rectifier. Its product description is MOSFET N-CH 300V 19A TO262-3-901. Review the specifications below when checking this part for your BOM.
The AUIRFSL6535 is an automotive-grade N-channel power MOSFET manufactured by Infineon Technologies under the International Rectifier brand. It utilizes advanced HEXFET process technology to achieve low on-resistance and fast switching capabilities within a TO-262-3 (D2PAK) through-hole package. The device features a drain-source breakdown voltage of 300 V, a continuous drain current of 19 A, and a maximum on-resistance of 145 mΩ at 10 V gate drive. It supports a junction temperature up to 175°C and holds AEC-Q101 qualification for automotive reliability.
Verify component authenticity through authorized distributors or direct manufacturer channels due to potential counterfeit risks in the aftermarket. Confirm specific lot codes and date codes against project requirements. Ensure packaging integrity matches the specified tube format. Cross-reference datasheet revisions to guarantee parameter consistency with design specifications before final procurement commitment.
Select this component when automotive qualification and high-voltage handling are required. Compare Rds(on) values against thermal constraints to ensure adequate heat dissipation in the TO-262-3 package. Evaluate gate drive requirements against the 5 V threshold voltage. Consider alternative packages if surface-mount space is limited, as this model uses a through-hole configuration.
This part belongs to the IRFS65xx series of automotive power MOSFETs. It shares core electrical characteristics with the AUIRFS6535TRL but differs in packaging and mounting style. The series is designed for robust performance in demanding automotive electrical systems, offering a balance of voltage rating and current handling capability.
The AUIRFS6535TRL serves as a functional equivalent with identical electrical parameters but in a DPAK surface-mount package. Verify pinout compatibility and thermal resistance differences when substituting. No other direct cross-references are confirmed in public documentation.
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