BAL-CC25-01D3

Balun Overview

The STMicroelectronics BAL-CC25-01D3 is an ultra-miniature balun integrating a matching network in a monolithic glass substrate. It operates within the 2.379GHz to 2.507GHz frequency range with a bandwidth of 2.45GHz. The device features a 50 Ohm nominal input and provides a conjugate match for CC253x, CC254x, CC257x, and CC852x series circuits. Packaged in a 4-terminal UFBGA/FCBGA format, it measures 0.94mm in length. The component supports surface mount mounting and functions across an operating temperature range from -40°C to 125°C.

Balun Feature Summary

• Integrates a matching network within a monolithic glass substrate for optimized RF performance
• Provides low insertion loss, low amplitude imbalance, and low phase imbalance
• Customized conjugate matching specifically designed for Texas Instruments CC25xx and CC85xx families

Balun Applications

• Wireless sensor networks utilizing CC253x or CC254x transceivers
• Bluetooth Low Energy (BLE) modules based on CC257x chips
• IoT applications requiring compact RF front-end solutions for CC852x processors

Balun Procurement Notes

Verify that the specific application circuit utilizes Texas Instruments CC253x, CC254x, CC257x, or CC852x series components, as the internal matching network is customized for these specific conjugate impedances. Ensure the design accommodates the 4-terminal UFBGA/FCBGA package dimensions and the specified -40°C to 125°C operating temperature range. Confirm that the 2.379GHz to 2.507GHz frequency band aligns with the target wireless protocol requirements before finalizing the procurement.

Balun Selection Notes

Select this component when a highly integrated, ultra-miniature solution is required for sub-GHz or 2.4GHz ISM band applications involving TI CC-series chips. The monolithic glass substrate construction offers superior RF performance compared to discrete implementations. Consider the small footprint constraint if board space is limited. This part is suitable for designs prioritizing low amplitude and phase imbalance alongside minimal insertion loss in a compact CSP-4 package.

Balun Part Context

This balun belongs to STMicroelectronics' family of ultra-miniature RF transformers designed for wireless connectivity. It leverages IPD technology on a non-conductive glass substrate to achieve high performance in a tiny form factor. Similar parts in the portfolio include models tailored for Nordic Semiconductor nRF series chips, such as the BAL-NRF01D3, which share the same integration philosophy but feature different impedance matching profiles for distinct semiconductor ecosystems.

Balun Replacement Considerations

Direct replacements must maintain compatibility with CC25xx or CC85xx chipsets. The BAL-CC25-02D3 is a related variant within the same product line; however, verify if its specific matching parameters suit the target circuit. No other public substitute part numbers are confirmed for this specific model.