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BCM8727MBIFBG is listed in the Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Broadcom Limited. Its product description is IC TRANSCEIVER FULL 2/2 324BGA. Review the specifications below when checking this part for your BOM.
The BCM8727MBIFBG is a dual-channel 10-GbE SFI-to-XAUI transceiver with Electronic Dispersion Compensation (EDC). It supports SFP+ SR, LR, and LRM optical interfaces and up to 15m of direct attached copper. The device features an integrated microcontroller and AGC with wide dynamic range. It operates at 10.3125 Gbps on the PMD interface and 3.125 Gbps per lane on the XAUI interface. Power dissipation is 2.4W with core supply at 1.0V and I/O at 3.3V. It uses a 19 mm x 19 mm BGA package with 1-mm ball pitch.
Verify component authenticity through authorized channels due to end-of-life status. Confirm RoHS compliance documentation matches specific manufacturing lot requirements. Ensure handling procedures account for the 19 mm x 19 mm BGA package specifications during assembly.
Select this component for designs requiring dual-channel SFI-to-XAUI conversion with EDC. Verify compatibility with existing 156.25 MHz reference clock sources. Ensure board layout accommodates the 324-pin BGA footprint and thermal requirements for 2.4W power dissipation.
This part belongs to the Broadcom BCM8727 series of high-performance Ethernet PHY devices. It is designed for line-card applications supporting various optical and copper media types. The device integrates advanced DSP functions to ensure signal integrity across different transmission distances.
Public confirmed substitute part numbers are not available in the provided documentation.
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BCM8727MBIFBG is listed in the Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Broadcom Limited. Its product description is IC TRANSCEIVER FULL…
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