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BD25GA3MEFJ-LBH2 is listed in the Voltage Regulators - Linear, Low Drop Out (LDO) Regulators range at ChipApex. The manufacturer field lists Rohm Semiconductor. Its product description is IC REG LIN 2.5V 300MA 8-HTSOP-J. Review the specifications below when checking this part for your BOM.
The BD25GA3MEFJ-LBH2 is a fixed-output Low Dropout (LDO) voltage regulator manufactured by ROHM Semiconductor. It provides a stable 2.5 V output with a maximum current capacity of 300 mA. The device operates within an input voltage range of 4.5 V to 14 V and features a typical dropout voltage of 600 mV at full load. Designed for industrial applications, it supports surface-mount installation in an HTSOP-J8 package. The regulator functions reliably across a temperature range from -40°C to +105°C, ensuring consistent performance in demanding environments.
Verify component authenticity through authorized distributors. Confirm that the specific suffix matches the required package and tape/reel specifications. Check for end-of-life status as some variants are marked not recommended for new designs. Ensure compliance with RoHS directives if applicable to your manufacturing process.
Select this regulator when a precise 2.5 V rail is needed with moderate current demands up to 300 mA. Consider the HTSOP-J8 package constraints for PCB layout. Evaluate thermal dissipation requirements based on the input-to-output voltage differential and ambient operating conditions to ensure reliability within the specified temperature range.
This component belongs to the BD25 series of LDO regulators designed for robust performance in industrial and automotive sectors. The series emphasizes high accuracy and integrated protection features. The BD25GA3MEFJ-LBH2 variant specifically targets applications requiring fixed voltage outputs with reliable operation under varying load and line conditions.
Consult official substitution lists for direct pin-compatible alternatives. Verify that any replacement maintains the same 2.5 V output, 300 mA current rating, and HTSOP-J8 footprint. Ensure thermal and electrical characteristics match the original design requirements before implementation.
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