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BD50GA3VEFJ-ME2 is listed in the Voltage Regulators - Linear, Low Drop Out (LDO) Regulators range at ChipApex. The manufacturer field lists Rohm Semiconductor. Its product description is IC REG LINEAR 5V 300MA 8-HTSOP-J. Review the specifications below when checking this part for your BOM.
The BD50GA3VEFJ-ME2 is a fixed-output low-dropout regulator manufactured by ROHM Semiconductor, designed for automotive applications. It provides a stable 5 V output with a maximum current capacity of 300 mA. The device operates within an input voltage range of 4.5 V to 14 V and maintains functionality across an extended temperature range from -40°C to +105°C. Key electrical specifications include a typical dropout voltage of 600 mV at full load and a quiescent current of 600 µA. The unit features high accuracy with ±1.0% output voltage tolerance at 25°C and includes integrated protection mechanisms such as thermal shutdown and over-current protection.
Verify the complete part number including suffixes to ensure correct packaging and automotive qualification status. Confirm that the HTSOP-J8 package matches your PCB footprint requirements. Check for RoHS compliance documentation if environmental regulations apply to your assembly process. Ensure input voltage constraints are respected to prevent excessive power dissipation in the specified operating temperature range.
Select this component when a fixed 5 V supply is required for automotive-grade circuits with moderate current demands up to 300 mA. Consider the 600 µA quiescent current impact on overall system efficiency. Evaluate the thermal performance in HTSOP-J8 packaging against expected ambient temperatures and load conditions. Verify compatibility with downstream capacitor requirements for stability.
This device belongs to ROHM's automotive LDO regulator series, characterized by high precision and robust protection features. It is engineered specifically for the demanding electrical and thermal environments found in modern vehicles. The HTSOP-J8 package offers a compact solution for space-constrained automotive PCB designs while maintaining adequate thermal dissipation capabilities for continuous operation.
Publicly confirmed substitute part numbers are not available in the provided source material.
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