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BD50GC0WEFJ-E2 is listed in the Voltage Regulators - Linear, Low Drop Out (LDO) Regulators range at ChipApex. The manufacturer field lists Rohm Semiconductor. Its product description is IC REG LINEAR 5V 1A 8-HTSOP-J. Review the specifications below when checking this part for your BOM.
The BD50GC0WEFJ-E2 is a low-dropout (LDO) linear voltage regulator manufactured by ROHM Semiconductor. It provides a fixed positive output voltage of 5.0 V with a maximum output current capability of 1 A. The device operates within an input voltage range up to 35 V and features a typical dropout voltage of 300 mV at full load. It is housed in an HTSOP-J8 surface-mount package and supports an operating temperature range from -25 °C to +85 °C.
Verify the exact suffix E2 against the manufacturer's latest datasheet to confirm pinout compatibility and electrical specifications. Ensure the HTSOP-J8 package footprint matches your PCB design constraints. Confirm RoHS compliance status if required for your specific manufacturing standards before finalizing procurement orders.
Select this component when a fixed 5 V output is required with up to 1 A load current and input voltages up to 35 V. The HTSOP-J8 package is suitable for space-constrained surface-mount applications. Consider the 300 mV dropout voltage for headroom calculations and ensure adequate thermal management for the operating environment within the specified temperature range.
This part belongs to the BDxxFC0WEFJ series of LDO regulators from ROHM, designed for general-purpose voltage regulation. The '50' indicates the 5.0 V fixed output version, while 'GC' denotes the specific performance grade and package type. The E2 suffix typically refers to environmental compliance or specific production line variations within the manufacturer's catalog.
Direct substitutes include other ROHM parts in the same family such as BD50FC0WEFJ-E2 or BD50HC5WEFJ-E2, provided they meet the 1 A current and 35 V input requirements. Verify that alternative packages like TO-252-3 are compatible with your assembly process if form-factor changes are acceptable.
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