BL 20 SMD 6

Headers, Receptacles, Female Sockets Overview

The Fischer Elektronik BL 20 SMD 6 is a surface-mount header connector featuring six positions with a 0.100-inch (2.54 mm) pitch. It utilizes gold-plated contacts and is designed for reliable board-to-board or cable connections in compact electronic assemblies.

Headers, Receptacles, Female Sockets Feature Summary

• Surface-mount design for automated assembly processes
• Gold-plated contact finish for enhanced conductivity and corrosion resistance

Headers, Receptacles, Female Sockets Applications

• Compact electronic device interconnects
• Automated surface-mount technology production lines
• Board-to-board signal transmission

Headers, Receptacles, Female Sockets Procurement Notes

Verify the specific ordering suffix to confirm contact plating and packaging format. Ensure the selected variant matches the required pin count and mounting style for your circuit board layout. Cross-reference official datasheets to confirm mechanical dimensions and electrical ratings before finalizing procurement orders.

Headers, Receptacles, Female Sockets Selection Notes

Select this component when a low-profile, surface-mount solution with gold contacts is required. The 2.54 mm pitch ensures compatibility with standard PCB footprints. Consider thermal management and mating cycle requirements if the application involves frequent disconnection.

Headers, Receptacles, Female Sockets Part Context

This part belongs to Fischer Elektronik's BL series of precision-engineered connectors. The manufacturer specializes in high-grade heatsinks and electronic components, leveraging decades of German engineering expertise to produce reliable interconnect solutions for various industrial and consumer applications.

Headers, Receptacles, Female Sockets Replacement Considerations

Direct substitutes must match the 6-position count, 2.54 mm pitch, and surface-mount configuration. Verify that alternative headers offer compatible gold plating and similar mechanical retention features to ensure seamless integration without redesigning the PCB footprint.