BLM LA 1 12 Z

Headers, Receptacles, Female Sockets Overview

The Fischer Elektronik BLM LA 1 12 Z is a through-hole pin strip header connector designed for board-to-board connectivity. It features a single row with 12 contacts and a pitch spacing of 1.27mm (0.050 inches). The contact material is a CuSn alloy, with the contact surface tin-plated. The component is engineered for reliable performance in industrial applications.

Headers, Receptacles, Female Sockets Feature Summary

• Single row configuration providing direct board-to-board connectivity
• Through-hole mounting method for secure PCB attachment
• Tin-plated contact surfaces to ensure signal integrity

Headers, Receptacles, Female Sockets Applications

• Industrial electronic equipment interconnects
• Board-to-board signal transmission systems
• General purpose PCB assembly requiring reliable pin headers

Headers, Receptacles, Female Sockets Procurement Notes

Verify the specific ordering suffix 'Z' against the manufacturer's current datasheet to confirm exact plating specifications and mechanical dimensions. Ensure compatibility with mating female connectors regarding pitch and row count before procurement.

Headers, Receptacles, Female Sockets Selection Notes

Select this component when a single-row, 12-position through-hole header is required. The 1.27mm pitch suits standard density layouts. Confirm that the tin-plated finish meets environmental or conductivity requirements compared to gold alternatives.

Headers, Receptacles, Female Sockets Part Context

This part belongs to the BLM LA 1 series from Fischer Elektronik, which offers single-row headers ranging from 1 to 36 contacts. The series is characterized by high-quality construction intended for robust industrial connectivity solutions and standard PCB integration.

Headers, Receptacles, Female Sockets Replacement Considerations

The alternative designation BLM LA 1 12 G exists within the same product family. Verify if the gold plating variant is acceptable as a substitute for the tin-plated version based on application requirements.