BMC2CY0300AN

Chip Ferrite Bead Overview

The BMC2CY0300AN is a single-line sigma multilayer ferrite bead manufactured by TE Connectivity Passive Product. It features a 1204 (3216 metric) surface-mount package with dimensions of 3.2 mm length, 1.6 mm width, and 1.1 mm height. The component provides an impedance of 300 Ohms at a test frequency of 100 MHz. It has a maximum DC resistance of 200 mOhms and a rated current of 350 mA. The device operates within a temperature range of -55°C to +125°C and carries the manufacturer part number 1-2176494-1.

Chip Ferrite Bead Feature Summary

• Provides effective electromagnetic interference (EMI) protection through high-frequency signal attenuation.
• Utilizes sigma multilayer technology for compact surface-mount integration.
• Designed for stable performance across a wide industrial operating temperature range.

Chip Ferrite Bead Applications

• High-frequency noise suppression in electronic circuits
• Signal integrity enhancement on data lines
• Electromagnetic compatibility filtering in consumer electronics

Chip Ferrite Bead Procurement Notes

Verify the specific ordering suffix and package variant when sourcing this component, as TE Connectivity may offer multiple configurations within the same base series. Confirm that the selected version matches the required impedance tolerance and current rating for your specific circuit design. Always cross-reference the manufacturer part number with official datasheets to ensure compliance with RoHS standards and material specifications before finalizing procurement decisions.

Chip Ferrite Bead Selection Notes

Select this component based on its 300 Ohm impedance profile at 100 MHz and 350 mA current handling capability. Ensure the 1204 footprint fits the available board space. Consider the low DC resistance of 200 mOhms to minimize voltage drop in power-sensitive applications. Verify thermal stability requirements against the specified -55°C to +125°C operating range.

Chip Ferrite Bead Part Context

This ferrite bead belongs to the BMC series of passive components from TE Connectivity. It is designed for surface-mount assembly, offering a compact solution for EMI suppression. The product utilizes multilayer ceramic technology to achieve high impedance in a small form factor, suitable for modern dense PCB layouts.

Chip Ferrite Bead Replacement Considerations

No officially confirmed substitute part numbers are documented in the provided source material.