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BU1JUA3WNVX-TL is listed in the Voltage Regulators - Linear, Low Drop Out (LDO) Regulators range at ChipApex. The manufacturer field lists Rohm Semiconductor. Its product description is IC REG LINEAR 1.85V 300MA 4SSON. Review the specifications below when checking this part for your BOM.
The BU1JUA3WNVX-TL is a single-output Low Dropout (LDO) voltage regulator manufactured by ROHM Semiconductor. It belongs to the LDO Voltage Regulators product category and is designed for surface-mount installation in DFN-4 packages. The device provides a fixed positive output with a maximum current capability of 300mA. It operates within a standard temperature range and supports packaging formats including cut tape, MouseReel, and reel configurations.
Verify the specific output voltage value associated with the J suffix code against the official ROHM datasheet before integration. Confirm package dimensions and thermal characteristics match your PCB layout constraints. Ensure compatibility with your system's input voltage range and load current demands. Check for any RoHS compliance documentation updates relevant to your region.
Select this component when a fixed low-dropout regulator with 300mA capacity is required in a small footprint. Consider the DFN-4 package for thermal performance and size efficiency. Evaluate the fixed output option against adjustable alternatives if precise voltage tailoring is not needed. Verify that the operating temperature range meets your environmental specifications.
This part is part of ROHM's broader portfolio of CMOS LDO regulators. It shares family characteristics such as low quiescent current and high ripple rejection ratios common to the series. The BU1JUA3WNVX-TL specifically targets applications requiring reliable, noise-sensitive power delivery in compact form factors.
Consult the official ROHM replacement guide or distributor cross-reference lists for verified substitutes. Ensure any alternative maintains identical pinout, voltage rating, and current capacity. Verify package compatibility to avoid PCB redesign efforts.
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