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BV301S06020 is listed in the Power Transformers range at ChipApex. The manufacturer field lists Zettler Magnetics. Its product description is 2VA PWR XFMR 50/60HZ. Review the specifications below when checking this part for your BOM.
The BV301S06020 is a 2VA encapsulated power transformer from Zettler Magnetics, designed for through-hole mounting. It features a single primary winding rated for 115V input and a single secondary winding providing 6V output at 333mA. The unit utilizes an EI30 laminated core structure and is fully encapsulated under vacuum pressure to ensure compactness and efficiency. Key electrical specifications include a turns ratio of 38:1 and standard operation at 50/60 Hz frequencies.
Verify the specific secondary voltage rating and current capacity against the target circuit design before procurement. Confirm that the through-hole package dimensions align with the PCB footprint requirements. Ensure the operating frequency matches the system's 50 or 60 Hz standard. Check for any specific regulatory compliance needs regarding the encapsulation material and core type for the intended application environment.
Select this component when a compact, encapsulated transformer is required for low-power linear applications. The 2VA rating suits circuits needing modest isolation and voltage step-down. Consider the EI30 core size constraints within the device enclosure. This model is appropriate where vacuum encapsulation provides necessary durability against mechanical stress or moisture compared to non-encapsulated alternatives.
This part belongs to the BV Series of encapsulated power transformers from Zettler Magnetics. The series is characterized by vacuum-pressure encapsulation techniques applied to laminated cores. These transformers are engineered to provide reliable performance in space-constrained environments while maintaining electrical isolation standards typical of general-purpose power conversion components.
Direct substitutes may include other BV series variants with matching VA ratings and encapsulation styles. Verify compatibility by comparing primary voltage inputs, secondary output voltages, and maximum current limits. Ensure the replacement maintains the same through-hole pin configuration and physical envelope dimensions to fit existing board layouts without modification.
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