BZT52B10T-TP

Single Zener Diodes Overview

The BZT52B10T-TP is a single Zener diode manufactured by Micro Commercial Components (MCC) in an SOD-523 surface-mount package. It features a nominal Zener voltage of 10 V with a tight tolerance of ±2%. The device operates within a junction temperature range of -65°C to +150°C and has a maximum power dissipation of 200 mW. Key electrical parameters include a test current of 5 mA, a maximum Zener impedance of 20 Ω at the test current, and a maximum reverse leakage current of 0.2 µA at 8.0 V.

Single Zener Diodes Feature Summary

• Planar die construction for robust performance
• ESD protection up to 16 kV (HBM)
• Halogen-free green device compliant with RoHS standards

Single Zener Diodes Applications

• Voltage reference circuits
• Overvoltage protection
• Clamping applications

Single Zener Diodes Procurement Notes

Verify the specific suffix 'B' indicates the ±2% voltage tolerance variant distinct from standard ±5% versions. Confirm the '-TP' suffix denotes tape and reel packaging containing 8,000 pieces per reel. Ensure the component meets UL 94 V-0 flammability ratings if required by the design specification.

Single Zener Diodes Selection Notes

Select this component when precise voltage regulation is required due to its narrow ±2% tolerance band. The SOD-523 package suits space-constrained designs, while the high operating temperature range supports demanding thermal environments. Verify that the 200 mW power rating aligns with the expected circuit load conditions.

Single Zener Diodes Part Context

This part belongs to the BZT52C(B) series of ultra-small Zener diodes designed for automated assembly processes. The series utilizes planar die construction and lead-free finishes. These devices are intended for general-purpose voltage regulation and protection tasks where compact size and reliability are prioritized.

Single Zener Diodes Replacement Considerations

Substitutes must match the 10 V nominal voltage, SOD-523 package, and ±2% tolerance. Verify equivalent power dissipation and thermal resistance characteristics to ensure compatibility with existing board layouts and thermal management strategies.