Digital Signal Processor Dsp C6713BZDPA200CIS product image

C6713BZDPA200CIS

$31.23
  • Description:IC FLOATING POINT DSP 272-BGA
  • Series:TMS320C67x

SKU:0cec8866c3be Category: Brand:

  
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C6713BZDPA200CIS is listed in the Digital Signal Processor Dsp range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC FLOATING POINT DSP 272-BGA. Review the specifications below when checking this part for your BOM.

Digital Signal Processor Dsp specifications for C6713BZDPA200CIS

  • Description:IC FLOATING POINT DSP 272-BGA
  • Series:TMS320C67x
  • Mfr:Texas Instruments
  • Package:Tray
  • Type:Floating Point
  • Interface:Host Interface, I2C, McASP, McBSP
  • Clock Rate:200MHz
  • Non-Volatile Memory:External
  • On-Chip RAM:264kB
  • Voltage - I/O:3.30V
  • Voltage - Core:1.20V
  • Operating Temperature:-40°C ~ 105°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:272-BBGA
  • Supplier Device Package:272-BGA (27x27)

Digital Signal Processor Dsp datasheet and documents for C6713BZDPA200CIS

C6713BZDPA200CIS

Digital Signal Processor Dsp Overview

The TMS320C6713BZDPA200 is a floating-point digital signal processor from the Texas Instruments C6000 platform. It features a C67x VLIW core with eight independent functional units, including two multipliers and four ALUs. The device operates at a maximum clock frequency of 200 MHz, delivering up to 1600 MIPS and 1600 MFLOPS. It integrates a memory architecture comprising 4 KB L1P cache, 4 KB L1D cache, and 256 KB of shared L2 memory. The component utilizes a 272-pin BGA package and supports 3.3V I/O voltages alongside a 1.2V core supply.

Digital Signal Processor Dsp Feature Summary

  • C67x Floating-Point DSP Core: 8 instructions per cycle with dual multipliers for high-throughput arithmetic.
  • Memory Hierarchy: 4KB L1P direct-mapped cache, 4KB L1D 2-way set-associative cache, and 256KB configurable L2 memory.
  • Peripheral Interface: Includes McASP, McBSP, I2C, GPIO, timers, HPI, and EMIF for external memory connectivity.
  • Package Specifications: 272-pin Ball Grid Array (BGA) with dimensions of 27mm x 27mm.

Digital Signal Processor Dsp Applications

  • Multi-channel audio processing systems
  • Image processing and computer vision applications
  • Software-defined radio implementations
  • Medical imaging equipment

Digital Signal Processor Dsp Procurement Notes

Verify the specific suffix 'CIS' against official Texas Instruments documentation to confirm temperature range and packaging details. Ensure compatibility with 3.3V logic levels for interface connections. Check for RoHS compliance status in current datasheets. Confirm availability as this model may be subject to lifecycle changes.

Digital Signal Processor Dsp Selection Notes

Select this component for applications requiring high-performance floating-point calculations at moderate clock speeds. The 200MHz variant offers a balance between power consumption and processing capability compared to higher-frequency models. Ensure sufficient external memory bandwidth if utilizing the EMIF extensively.

Digital Signal Processor Dsp Part Context

This part belongs to the TMS320C6713B series within the C6000 DSP family. It shares architectural similarities with other C67x devices but is distinguished by its specific clock speed and pin configuration. The ZDP suffix typically indicates a 272-pin BGA package optimized for dense board layouts.

Digital Signal Processor Dsp Replacement Considerations

Direct replacements include other C6713B variants such as the 225MHz or 300MHz versions, provided the clock speed requirements are met. Cross-model compatibility exists within the C6000 family, though pinouts and memory configurations must be verified.

C6713BZDPA200CISC6713BZDPA200CIS
$31.23
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