CBT16212DGG,112

Signal Switches, Multiplexers, Decoders Overview

The CBT16212DGG,112 is a Bus FET exchange switch manufactured by Nexperia USA Inc. It features a 12 x 2:2 circuit configuration housed in a 56-TSSOP package. The device operates on a single supply voltage ranging from 4V to 5.5V. It supports an operating temperature range of -40°C to 85°C (TA).

Signal Switches, Multiplexers, Decoders Feature Summary

• Integrates 12 independent circuits within a single component.
• Utilizes Bus FET technology for signal switching applications.

Signal Switches, Multiplexers, Decoders Applications

• Signal routing in electronic systems
• Data bus management
• Logic level translation interfaces

Signal Switches, Multiplexers, Decoders Procurement Notes

Verify the specific suffix '112' against official Nexperia documentation to confirm exact packaging and tape-and-reel specifications. Ensure the 56-TSSOP footprint matches the target PCB design. Confirm that the 4V-5.5V supply range aligns with system power rails before finalizing procurement.

Signal Switches, Multiplexers, Decoders Selection Notes

Select this component when a high-density solution for multiple signal paths is required. The 56-terminal TSSOP package offers space efficiency for compact designs. Verify that the 4V minimum supply voltage meets the lowest expected system operating condition to ensure reliable switching performance across the full temperature range.

Signal Switches, Multiplexers, Decoders Part Context

This part belongs to the CBT1621x series of Bus FET switches. It shares the base architecture with variants like CBT16212DGG,118. The series is designed for low-power, high-speed signal switching applications requiring multiple independent channels in a small form factor.

Signal Switches, Multiplexers, Decoders Replacement Considerations

CBT16212DGG,118 is a documented variant within the same product family. Verify pinout compatibility and package dimensions before substitution. Ensure the alternative suffix meets the same electrical and thermal requirements.