SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Hoffman Enclosures CCAP2616 is an internal panel designed for Compact Series enclosures. It measures 9.880 x 5.940 inches (246 x 146 mm) with a thickness of 1/4 inch. Constructed from plated steel, the panel provides a conductive surface suitable for mounting electro-mechanical components within the enclosure.
Verify that the target enclosure belongs to the Hoffman Compact Series and matches the 260x160mm footprint. Confirm material specifications align with project requirements, as some sources describe the material as aluminum while official documentation specifies plated steel. Ensure the 1/4 inch thickness fits the internal depth constraints of the specific enclosure model in use.
Select this part when an internal mounting surface is required for Compact Series housings. The plated steel construction offers conductivity distinct from non-conductive alternatives. Verify compatibility with the specific enclosure dimensions, as the panel is engineered specifically for the 260x160mm form factor associated with the Compact line.
This component serves as an accessory for the Hoffman Compact Series of industrial enclosures. It functions as a backplate or internal support structure, allowing users to securely attach switches, relays, or other hardware inside the main housing. It is part of a broader ecosystem of accessories designed to customize standard enclosure sizes.
No public confirmed substitute part numbers are available.

Understand UART protocol framing, baud rate and electrical interfaces. Learn 8N1 timing, TX/RX wiring, buffering and practical troubleshooting steps.
Read More
Geneva, Switzerland – March 25, 2026 – STMicroelectronics N.V. (NYSE: STM), a global semiconductor leader serving customers across the electronics applications spectrum, has announced…
Read MoreSeptember 16, 2026 – Global — Leading semiconductor manufacturer ON Semiconductor (onsemi, NASDAQ: ON) has officially issued a formal price adjustment letter to global…
Read More
Compare Pt100 and Pt1000 RTDs, two-, three- and four-wire connections, excitation and self-heating. Build an error budget from element to reported temperature.
Read More
In the embedded world, general-purpose CPUs are great at running operating systems, and MCUs excel at logic control. But when you need to process…
Read More
The global memory market is entering an unprecedented supply-constrained phase as soaring demand from artificial intelligence (AI) infrastructure collides with strategic capacity reallocations by…
Read More
Select MOV varistors by continuous voltage, clamping behavior, surge waveform and repetition. Check thermal disconnection, fuse coordination and replacements.
Read More
Understand voltage controlled oscillator tuning, phase noise and PLL operation. Check supply noise, output loading and requirements before selection.
Read More
TOKYO, April 1, 2026 – Kioxia Corporation (formerly Toshiba Memory Corporation), a global leader in flash memory and storage solutions, has officially issued a…
Read More
Compare SPST and SPDT toggle switches, understand AC/DC ratings, and follow wiring examples. Check contact action, mounting and parts in the ChipApex catalog.
Read More
Understand thermal fuse operation, Tf, Th and Tm, electrical ratings and mounting. Check temperature limits and replacement requirements for your design.
Read More
Recently, the global electronic components market has been constantly evolving, and different regions and enterprises have witnessed new moves in aspects such as technological…
Read More